Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-9648
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... DAT0 not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x7BB8D32F
Manufacturing date: May 2018
CID: 15010047 4436424D 42017BB8 D32F55C4
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6765, cpu abi: armeabi-v7a
manufacturer: Xiaomi
board: cereus, name: cereus
brand: xiaomi, model: Redmi 6
build model list: Redmi 6
build id: O11019, version: 8.1.0 Oreo (O11019)
build description: cereus-user 8.1.0 O11019 V10.3.6.0.OCGMIXM release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G
Interface: UFI High-Speed
Serial number: 0011-8840-9648
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... DAT0 not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x7BB8D32F
Manufacturing date: May 2018
CID: 15010047 4436424D 42017BB8 D32F55C4
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6765, cpu abi: armeabi-v7a
manufacturer: Xiaomi
board: cereus, name: cereus
brand: xiaomi, model: Redmi 6
build model list: Redmi 6
build id: O11019, version: 8.1.0 Oreo (O11019)
build description: cereus-user 8.1.0 O11019 V10.3.6.0.OCGMIXM release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G
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